Semiconductor device having detection electrodes

ABSTRACT

A sealing member containing conductive particles and disposed in a seal region is formed between a display panel and a touch panel. A laminated structure formed on the display panel includes a first detection lines. The first detection lines extend from the seal region to a connection region and are connected through the conductive particles to terminals of second detection lines formed on the touch panel. A peripheral edge of the organic barrier is located inward from the conductive particles of the sealing member. The above described structure can facilitate a work for connecting external lines such as FPC to the display panel and the touch panel. Further, the structure can secure stability of electrical connection between the external lines and the touch panel.

CROSS-REFERENCE TO RELATED APPLICATION

This is a continuation of U.S. application Ser. No. 16/453,493, filedJun. 26, 2019, which is a continuation of U.S. application Ser. No.16/139,844, filed Sep. 24, 2018, which is a continuation of U.S.application Ser. No. 15/833,557, filed Dec. 6, 2017 (now U.S. Pat. No.10,109,687), which is a continuation of U.S. application Ser. No.15/336,026, filed Oct. 27, 2016 (now U.S. Pat. No. 9,871,083) and claimspriority to Japanese Application No. 2016-006329, filed on Jan. 15,2016. The content of each of the above-identified applications is herebyincorporated by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a display device.

2. Description of the Related Art

Some liquid crystal display devices and some organic EL display devicesinclude a touch panel to detect positions of user's fingers on thepanel. A touch panel described in JP2009-116090A (hereinafter referredto as “Patent document 1”) has a plurality of first detection electrodesand a plurality of second detection electrodes formed on one surface ofthe touch panel. The first detection electrodes are aligned in alongitudinal direction, and the second detection electrodes are alignedin a lateral direction. An edge of the touch panel (referred to as“front pad portion” in Patent Document 1) has terminals formed thereonthat are respectively provided in detection lines extending fromdetection electrodes. An external flexible printed circuit (FPC) isattached to the terminals.

Display panels of organic EL display devices include an organic layerincluding a light emitting layer made of organic materials. The organiclayer tends to be deteriorated under the influence of moisture. In orderto prevent moisture from penetrating the organic layer, some organic ELdisplay devices include a barrier layer covering the organic layer.JP2014-154450A discloses a barrier layer including two inorganic barrierlayers between which an organic barrier is disposed.

SUMMARY OF THE INVENTION

Similarly to in the organic EL display device disclosed in patentdocument 1, in organic EL display device including a touch panel,external electric lines such as FPCs are connected to the display paneland the touch panel of the display device. However, the conventionalstructure has a problem that laborious works are necessary forconnecting the external electric lines to the display panel and thetouch panel, respectively.

The present invention is to provide a technology that facilitates worksfor connecting external electric lines such as FPCs to the display paneland the touch panel and that secures stability of electrical connectionbetween the external electric line and the touch panel provided in adisplay device including a multilayer barrier covering the organiclayer.

A display device comprising: a display panel including a display region;a touch panel facing the display panel; a seal region located outsidethe display region and surrounding the display region; and a connectionregion located outside a portion of a peripheral edge of the sealregion. The display panel includes a first substrate and a firstlaminated structure formed on a surface of the first substrate facingthe touch panel. The touch panel includes a second substrate and asecond laminated structure formed on a surface of the second substratefacing the display panel. The first laminated structure includes: anorganic layer including a light emitting layer and formed on the displayregion; a multilayer barrier covering the whole of the organic layer andincluding a first inorganic barrier layer that includes an inorganicmaterial, an organic barrier layer that includes an organic material andis formed on the first inorganic barrier layer, and a second inorganicbarrier layer that includes an inorganic material and covers the wholeof the organic barrier layer. The second laminated structure includes acircuit layer including a detection electrode and a second detectionline that extends from the detection electrode and includes a terminalin the seal region. A sealing member is located in the seal region anddisposed between the display panel and the touch panel, the sealingmember containing a conductive particle. The first laminated structureincludes a first detection line extending from the seal region to theconnection region and electrically connected to the terminal of thesecond detection line through the conductive particle. The organicbarrier layer includes a peripheral edge located inward from theconductive particle.

In the display device described above, the first detection line isformed on the display panel and thus the works for connecting externallines such as FPC to the display panel and the touch panel can befacilitated. Further, because the peripheral edge of the organic barrierlayer is located inward from the conductive particle, stability ofelectrical connection between the external electric line and the touchpanel can be secured.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an exemplary display device of embodiments accordingto the present invention.

FIG. 2 is a cross section taken along line II-II in FIG. 1.

FIG. 3 illustrates an exemplary circuit formed in a circuit layer of thedisplay device.

FIG. 4 illustrates an exemplary conductor pattern formed in a circuitlayer of a touch panel.

FIG. 5 is a cross section taken along line V-V indicated in FIG. 1.

FIG. 6 is a cross section illustrating a state where a connection regionin the display panel is folded. The cross section plane of the FIG. 6 isthe same as that of FIG. 5.

FIG. 7 is a plan view illustrating another exemplary display device ofthe embodiments according to the present invention.

FIG. 8 is a cross section taken along line VIII-VIII indicated in FIG.7.

FIG. 9 is a cross section taken along line IX-IX indicated in FIG. 7.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, embodiments according to the present invention will bedescribed. FIG. 1 illustrates a display device 1 that is an example ofthe embodiments according to the present invention. FIG. 2 is a crosssection taken along line II-II in FIG. 1. FIG. 3 illustrates anexemplary circuit formed in a circuit layer 31 of the display panel 3.FIG. 4 illustrates an exemplary conductor pattern formed in a circuitlayer 21 of a touch panel 2. FIG. 5 is a cross section taken along lineV-V indicated in FIG. 1. FIG. 6 is a cross section illustrating a statewhere a connection region A3 in the display panel 3 is folded. Thefollowing explanation refers to a direction toward the touch panel 2from the display panel 3 as “upward direction”, and refers to adirection toward the display panel 3 from the touch panel 2 as “downwarddirection”. Further, the following explanation refers to a directiontoward the center of a display region described later as “inwarddirection”.

The present specification merely discloses an example. Thus, embodimentswhich maintain the spirit of the present invention and are easilymodified by those skilled in the art are surely contained in the scopeof the invention. In addition, a width, a thickness, and a shape of eachportion shown in the drawings are merely an example. The width, thethickness, and the shape shown in the drawings do not limit theinterpretation of the invention.

The organic electroluminescent (EL) display device 1 includes a displaypanel 3 and a touch panel 2 facing the display panel 3. As shown in FIG.1, the display panel 3 and the touch panel 2 include a display region A1constituted by a plurality of pixels, and include a seal region A2located outside display region A1. The seal region A2 has a sealingmember 52 (see FIG. 5) disposed therein. The sealing member 52 is formedbetween the display panel 3 and the touch panel 2 to adhere those panelsto each other. The display panel 3 includes a connection region 3located outside a portion of a peripheral edge (e.g., one side of therectangularly shaped seal region A2) of the seal region A2. The touchpanel 2 has a size correspond to the display region A1 and the sealregion A2 each formed on the display panel 3. Accordingly, the touchpanel 2 does not cover the connection region 3. The display panel 3 isrectangular, and the connection region A3 is located along one of thefour sides of the rectangular display panel 3. The connection region 3has an external electric line attached thereon. In the example describedin the present specification, a flexible printed circuit (FPC) 65 isemployed as the external electric line and attached on the connectionregion 3 (see FIG. 6). In this regard, a non-light emitting region inwhich pixels are not formed and the sealing member 52 is not providedmay be secured between the display region A1 and the seal region A2shown in FIG. 1. The non-light emitting region has, for example, adriver circuit formed thereon.

As shown in FIG. 2, the display panel 3 includes a first substrate 30.The first substrate 30 is made of resin, such as polyimide resin, andhas flexibility. As described later, the flexibility allows theconnection region A3 of the display panel 3 to be folded opposite thetouch panel 2 (see FIG. 6).

The first substrate 30 includes a surface facing the touch panel 2. Thedisplay panel 3 includes a laminated structure on the surface of thefirst substrate 30. The laminated structure of the display pane 13 isformed between the first substrate 30 and a filler 51 shown in FIG. 2.The following explanation refers to the laminated structure as “firstlaminated structure”.

As shown in FIG. 2, the first laminated structure includes an organiclayer 33 including a light emitting layer. The organic layer 33 mayfurther include a hole injection layer, a hole transmission layer, anelectron injection layer, and an electron transmission layer. In theexample of organic EL display device 1, the organic layer 33 has acommon laminated structure throughout the region of pixels so that theentire organic layer 33 emits light of the same color (e.g., whitelight). In another example, the organic layer 33 may have a laminatedstructure of the pixels that correspond to the respective colors so asto emit light of colors of the respective pixels. For example, theorganic layer 33 in the red pixel Pr may be formed so as to emit redlight, the organic layer 33 in the green pixel Pg may be formed so as toemit green light, and the organic layer 33 in the blue pixel Pb may beformed so as to emit blue light.

As shown in FIG. 2, the first laminated structure includes a pluralityof lower electrodes 32 respectively formed on the plurality of pixels.Further, the first laminated structure includes a bank layer 35. Thebank layer 35 has banks 35 a formed therein. Each bank 35 is locatedbetween two adjacent pixels and disposed on the peripheral portion ofthe lower electrode 32. The organic layer 33 is formed on the lowerelectrodes 32 and the bank layer 35. The organic layer 33 has a portionthat is located inside the banks 35 and is in contact with the lowerelectrode 32. An upper electrode 34 is formed on the organic layer 33.In an example, the upper electrode 34 is continuously formed throughoutthe display region A1. The lower electrode 32 and the upper electrode 34supply electric charges (that is, electric current) to the organic layer33. For example, the lower electrode 32 is an anode to supply holes tothe organic layer 33. The upper electrode 34 is a cathode to supplyelectrons to the organic layer 33.

As shown in FIG. 2, the first laminated structure includes a circuitlayer 31 formed on the first substrate 30. The lower electrodes 32 areformed above the circuit layer 31. The circuit layer 31 has circuitsformed therein that control electric current to be supplied to the lowerelectrodes 32.

As shown in FIG. 3, the circuit layer 31 includes a pixel circuit 31Aformed in each pixel. The pixel circuit 31A includes a plurality of TFTs(Thin Film Transistor) 31 a, 31 b, capacitor 31 c, and the like.Further, the circuit layer 31 has scan signal lines 31B extending in anX direction, image data signal lines 31C extending in a Y direction, anddrive power source lines 31D extending in the Y direction. The scansignal lines 31B are respectively formed for pixel rows that arearranged in the Y direction. The image data signal lines 31C arerespectively formed for pixel lines that are arranged in the Xdirection. The scan signal lines 31B are selected in order by a scansignal line drive circuit (not shown). The selected scan signal line 31Breceives a voltage for turning on a switching TFT 31 a formed in eachpixel. The image data signal line 31 c receives a voltage correspondingto a data signal for a pixel that is connected to the selected scansignal line 31B. The voltage is applied to the capacitor 31 c throughthe switching TFT 31 a. A drive TFT 31 b supplies OLED 3 a with anelectric current corresponding to the voltage applied to the capacitor31 c. As a result, the OLED 3 a in the pixel connected to the selectedscan signal line 31B emits a light. The lower electrodes 32, the organiclayer 33, and the upper electrode 34 constitute the OLEDs 3 a. Theelectric current is supplied to the OLED 3 a through the drive powersource line 31D and the drive TFT 31 b. The anode of the OLED 3 a (lowerelectrode 32) is connected to the drive TFT 31 b. The cathode of theOLED 3 a is connected to the ground potential. The cathodes of all OLEDs3 a employ a common electrode (that is, the upper electrode 34). In thisregard, the pixel circuit 31A is not limited to the example shown inFIG. 3 and may be changed in various ways.

As shown in FIG. 1, the connection region A3 of the display panel 3 hasa plurality of first terminals 31 e formed thereon and a plurality ofsecond terminals 31 f formed thereon. The first terminals 31 e areprovided for the circuits formed in the circuit layer 31. In an example,a driver IC 62 is mounted on the connection region A3. The circuit layer31 has a plurality of lines (not shown) formed therein that connect thedriver IC 62 to the first terminals 31 e. Further, the circuit layer 31has a plurality of lines (not shown) formed therein that connect thedriver IC 62 to the scan signal lines 31B, the image data signal lines31C, and the drive power resource lines 31D. On the other hand, thesecond terminals 31 f are provided at the ends of the detection lines 61electrically connected to the touch panel 2 (hereinafter, the detectionline 61 is referred to as “first detection line”). As shown in FIG. 5,the peripheral edges of the terminals 31 e and 31 f may be covered withthe bank layer 35, which prevents the terminals 31 e and 31 f from beingpeeling off. Alternatively, the peripheral edges of the terminals 31 eand 31 f are covered with inorganic barrier layers 41 and 43 describedlater.

The first terminals 31 e are connected with external lines that supplythe display panel 3 with signals to drive the display panel 3. Thesecond terminals 31 f are connected with external lines that transmitsignals from the touch panel 2 to an external controller. In the exampleof organic EL display device 1, FPC 65 (shown in FIG. 6) is employed asboth of the external lines connected to the first terminals 31 e and theexternal lines connected to the second terminals 31 f.

For example, as shown in FIG. 1, all of the second terminals 31 f arearranged on one side of the plurality of first terminals 31 e. Thearrangement of the second terminals 31 f is not limited to the exampleshown in FIG. 1. In another example, the second terminals 31 f may bedistributed on two sides of the plurality of first terminals 31 e.

As shown in FIG. 2, the first laminated structure includes a multilayerbarrier 40 that prevents moisture from penetrating and spreading in theorganic layer 33. The multilayer barrier is formed on the upperelectrode 34 to cover the entire organic layer 33. In other words, themultilayer barrier 40 includes a peripheral edge located outside theperipheral edge of the organic layer 33. The multilayer barrier 40includes a first inorganic barrier layer 41, an organic barrier 42formed on the first inorganic barrier layer 41, and a second inorganicbarrier layer 43 formed on the organic barrier 42. That is, the organicbarrier 42 is sandwiched between the first inorganic barrier layer 41and the second inorganic barrier layer 43. The first inorganic barrierlayer 41 and the second inorganic barrier layer 43 are made of aninorganic material. Examples of the inorganic material are siliconenitride (Sin), silicone oxide (Sio), and the like. The first inorganicbarrier layer 41 and the second inorganic barrier layer 43 may be madeof the same material, or may be made of different materials from oneanother. Each of the first inorganic barrier layer 41 and the secondinorganic barrier layer 43 may include a plurality of layers. Theorganic barrier 42 is made of an organic material. The material of theorganic barrier 42 is, for example, an acrylic resin, a polyimide resin,an epoxy resin. When a foreign particle invades the upper electrode 34or the first inorganic barrier layer 41, for example, the organicbarrier 42 covers and encloses the foreign particle so that the barrierefficiency can be prevented from being deteriorated due to the foreignparticle. The second inorganic barrier layer 43 covers the entireorganic barrier 42. In a plan view of the display panel 3 (see FIG. 5),the peripheral portion 41 a of the first inorganic barrier layer 41 andthe peripheral portion 43 a of the second inorganic barrier layer 43 arelocated outside the peripheral edge 42 a of the organic barrier 42. Theperipheral portion 41 a of the first inorganic barrier layer 41 and theperipheral portion 43 a of the second inorganic barrier layer 43 are incontact with each other and have the organic barrier 42 formed insidethe peripheral portions 41 a and 43 a. The structure described here canprevent moisture from penetrating and spreading in the organic barrier42. The organic barrier 42 in an example has thickness larger than thatof the inorganic barrier layers 41 and 43.

As shown in FIG. 2, the touch panel 2 includes a second substrate 20.The second substrate 20 may employ a glass substrate or a resinsubstrate, such as an acrylic substrate. The second substrate 20includes a surface facing the display panel 3. The touch panel 2includes a laminated structure formed on the surface of the secondsubstrate 20. The laminated structure of the touch panel 2 is layersformed between the second substrate 20 and the filler 51 shown in FIG.2. Hereinafter, the laminated structure is referred to as “secondlaminated structure”. The second laminated structure includes a circuitlayer 21.

As shown in FIG. 4, the circuit layer 21 includes a conductor patternthat includes a plurality of first detection electrodes 21A eachextending in the X direction and a plurality of second detectionelectrodes 21B each extending in the Y direction. The first detectionelectrodes 21A are arranged in the Y direction. The second detectionelectrodes 21B are arranged in the X direction. In an example of thecircuit layer 21, each of the first detection electrodes 21A includes aplurality of square portions 21 c arranged in the X direction andconnecting portions 21 d each coupling two adjacent square portions 21 ctogether. Similarly to the first detection electrodes 21A, each of thesecond detection electrodes 21B includes a plurality of square portions21 c arranged in the Y direction and connecting portions 21 d eachcoupling two adjacent square portions 21 c together. The connectingportion 21 d of the first detection electrode 21A and the connectingportion 21 d of the second detection electrode 21B cross and have aninsulating layer formed therebetween. The touch panel 2 works as acapacitive touch sensor by using the detection electrodes 21A and 21Bdescribed above.

The conductor pattern of the circuit layer 21 includes a plurality ofdetection lines 21C respectively extending from ends of detectionelectrodes 21A and 21B (hereinafter, the detection line 21C is referredto as “second detection line”). The second detection lines 21C areformed along edges of the touch panel 2. Each of the sensor detectionlines 21C includes terminal 21Ca at the end thereof. The detectionelectrodes 21A and 21B of the circuit layer 21 are made of a transparentconductive material such as Indium Tin Oxide (ITO), Indium Zinc Oxide(IZO), and the like. The second detection lines 21C may be made of atransparent conductive material or a metal.

As shown in FIG. 2, the second laminated structure may include aprotection insulating layer 22 covering the circuit layer 21. Further,the second laminated structure may include a color filter layer 23formed on the lower side of the protection insulating layer 22. Thecolor filter layer 23 has color filters 23 r, 23 g, and 23 b formedtherein that each have the color of the pixel.

As described above, the second detection lines 21C are formed along theedges of the touch panel 2. As shown in FIGS. 4 and 5, each seconddetection line 21C includes a terminal 21Ca in the end thereof. Theterminal 21Ca is located in the seal region A2. The seal region A2 in aplan view is shaped in a frame surrounding the display region A1. Theseal region A2 includes a portion A2 s (see FIG. 4) located close to theconnection region A3 of the display panel 3 (hereinafter, the portion A2s is referred to as “connection side seal region”). The terminals 21Caof the plurality of second detection lines 21C are formed in theconnection side seal region A2 s. In an example of organic EL displaydevice 1, all terminals 21Ca are located in one side of the connectionside seal region A2 s (in FIG. 4, all terminals 21Ca are arranged closeto an edge 20 b of the second substrate 20). The positions of theterminals 21Ca are not limited to those described here. For example, theplurality of terminals 21Ca may be located on both sides of theconnection side seal region A2 s.

As shown in FIG. 5, the seal region A2 has a sealing member 52 disposedtherein. The sealing member 52 is disposed between the display panel 3and the touch panel 2 to bond the display panel 3 and the touch panel 2together. The display panel 3 and the touch panel 2 have a filler 51disposed therein. The filler 51 is located inside the seal region A2 andthe sealing member 52 seals a space filled with the filler 51.

As shown in FIG. 5, the first laminated structure of the display panel 3includes a plurality of first detection lines 61. The first detectionlines 61 extend to the connection region A3 from the connection sideseal region A2 s. Each first detection line 61 includes a portion 61 aformed in the connection side seal region A2 s (hereinafter, the portion61 a is referred to as “contact portion”). The first detection line 61extends to the second terminal 31 f in the connection region A3 from thecontact portion 61 a. In the example in FIG. 1, each first detectionline 61 extends straight in the y direction. The first detection lines61 are made of a metal that includes, for example, Al, Ag, and the like.The arrangement and the material of the first detection line 61 are notlimited to the example described here and may be changed in variousways.

As shown in FIG. 5, the contact portions 61 a of the first detectionlines 61 respectively face the terminals 21Ca of the second detectionlines 21C formed in the touch panel 2 in a thickness direction of thepanels 2 and 3 across the sealing member 52. The contact portions 61 aof the first detection lines 61 are formed in the first laminatedstructure and exposed toward the sealing member 52. The terminals 21Caof the second detection lines 21C are formed in the second laminatedstructure and exposed toward the sealing member 52. The sealing member52 includes conductive particles 53 made of conductive material. Thecontact portions 61 a of the first detection lines 61 are electricallyconnected with the terminals 21Ca of the second detection lines 21C,respectively, through the conductive particles 53. In other words, eachcontact portion 61 a of the first detection line 61 is in contact withthe conductive particle 53, and each terminal 21Ca of the seconddetection line 21C is in contact with the conductive particle 53. Thefirst detection lines 61 enable a FPC for the touch panel 2 to beattached on the connection region A3 of the display panel 3, not on thetouch panel 2. Accordingly, workability for attaching the FPC to thedisplay device 1 can be facilitated.

The conductive particle 53 has a diameter that corresponds to thedistance between the touch panel 2 and the display panel 3, for example.In more detail, the conductive particle 53 has a diameter thatcorresponds to the distance between the contact portion 61 a of thefirst detection line 61 and the terminal 21Ca of the second detectionline 21C. The diameter enables the contact portion 61 a of the firstdetection line 61 and the terminal 21Ca of the second detection line 21Cto be in contact with a common conductive particle 53. Further, theconductive particle 53 can function as a spacer. The diameter of theconductive particle 53 is preferably larger than the thickness of themultilayer barrier 40. Such a larger diameter enables the contactpressure between the conductive particle 53 and the second detectionline 21C and the contact pressure between the conductive particle 53 andthe first detection line 61 to be adequately secured. The diameter ofthe conductive particle 53 is not limited to the example described here.For example, the diameter of the conductive particle 53 may be smallerthan the distance between the contact portion 61 a of the firstdetection line 61 and the terminal 21Ca of the second detection line21C. In that case, the contact portion 61 a and the terminal 21Ca may beconnected with each other through a plurality of conductive particles53.

As shown in FIG. 5, the peripheral edge 42 a of the organic barrier 42is located inward from the conductive particles 53 contained in thesealing member 52. In other words, the peripheral edge 42 a of theorganic barrier 42 is located closer to the display region A1 than theconductive particles 53. In an example where a non-light emitting regionis formed between the display region A1 and the seal region A2, theperipheral edge 42 a of the organic barrier 42 may be located in thenon-light emitting region. The organic barrier 42 is relatively soft,because it is made of an organic material. Accordingly, in comparisonwith a structure where the conductive particles are located above theorganic barrier 42, the structure shown in FIG. 5 where the peripheraledge 42 a of the organic barrier 42 is located inward from theconductive particles 53 easily secures adequate contact pressuresbetween the conductive particle 53 and the contact portion 61 a of thefirst detection line 61 and between the conductive particle 53 and theterminal 21Ca of the second detection line 21C. As a result, theelectrical connection between them can be improved in the stability. Inan example, a plurality of conductive particles 53 may be arranged inthe width direction (E direction shown in FIG. 5) of the connection sideseal region A2 s. In this example, the plurality of conductive particles53 make an electrical connection between the contact portion 61 a of thefirst detection line 61 and the terminal 21Ca of the second detectionline 21C. In this example, the peripheral edge 42 a of the organicbarrier 42 is preferably located inward from the conductive particle 53disposed innermost among the plurality of conductive particles 53 (thatis, the peripheral edge 42 a is preferably located inward from theconductive particle 53 disposed closest to the display region A1 amongthe plurality of conductive particles 53).

In the example of organic EL display device 1, the peripheral edge 42 aof the organic barrier 42 is located inward from a portion of the sealregion A2 in which the conductive particle 53 is disposed. That is, theperipheral edge 42 a of the organic barrier 42 is located inward fromthe inner edge of the connection side seal region A2 s. That is, theperipheral edge 42 a of the organic barrier 42 is located closer to thedisplay region A1 than the inner edge of the connection side seal regionA2 s. The arrangement of the organic barrier 42 described here cansecure a further adequate contact pressure between the conductiveparticle 53 and the contact portion 61 a of the first detection line 61and a further adequate contact pressure between the conductive particle53 and the terminal 21Ca of the second detection line 21C. The entireperipheral edge 42 a of the organic barrier 42 may be located inwardfrom the seal region A2. That is, the peripheral edge 42 a of theorganic barrier 42 may be located inward from, not only the inner edgeof the connection side seal region A2 s, but also inner edges of otherportions of the seal region A2.

As shown in FIG. 5, each of the first inorganic barrier layer 41 and thesecond inorganic barrier layer 43 includes a portion located in the sealregion A2. The portions of the first inorganic barrier layer 41 and ofthe second inorganic barrier layer 43 are in contact with each other.The portions described here enable the organic barrier 42 to be surelyenclosed by the first inorganic barrier layer 41 and the secondinorganic barrier layer 43, even when the peripheral edge 42 a ispositioned closer to the seal region A2. Accordingly, moisture is surelyprevented from penetrating into the organic barrier 42. In the exampleof organic EL display device 1, the peripheral portion 41 a of the firstinorganic barrier layer 41 and the peripheral portion 43 a of the secondinorganic barrier layer 43 are located in the seal region A2 and incontact with each other. Alternatively, only one of the peripheralportion 41 a of the first inorganic barrier layer 41 and the peripheralportion 43 a of the second inorganic barrier layer 43 may be located inthe seal region A2. For example, only the peripheral portion 43 a of thesecond inorganic barrier layer 43 may be located on the seal region A2.

As shown in FIG. 5, in the example of organic EL display device 1, theinorganic barrier layers 41 and 43 are formed in the display region A1and the seal region A2, while not formed in the connection region A3.The peripheral edges of the inorganic barrier layers 41 and 43 arelocated inward from the peripheral edge of the seal region A2. Asdescribed later, the connection region A3 of the display panel 3 isfolded back (see FIG. 6). In comparison with a structure where theinorganic barrier layers 41 and 43 are formed in the connection regionA3, the structure shown in FIG. 5 where the inorganic barrier layers 41and 43 are not formed in the connection region A3 reduces the rigidityof the connection region A3 of the display panel 3 to facilitate foldingthe connection region A3. The inorganic barrier layers 41 and 43 can beformed by, for example, using a mask. For example, the inorganic barrierlayers 41 and 43 can be formed by a mask to block a material of theinorganic barrier layers 41 and 43 from being put on the connectionregion A3. The inorganic barrier layers 41 and 43 can be formed, forexample, by Chemical Vapor Deposition (CVD). Alternatively, theinorganic barrier layers 41 and 43 may be formed on the connectionregion A3, while not covering the second terminals 31 f. In that case,the inorganic barrier layers 41 and 43 can be formed by using a mask toblock the material of the inorganic barrier layers 41 and 43 from beingput on the second terminal 31 f.

As shown in FIG. 5, the circuit layer 31 includes a portion located inthe connection region A3. The portion of the circuit layer 31 has aplurality of lines (not shown) formed therein that connects the driverIC 62 to the plurality of first terminals 31 e (see FIG. 1). Further,the portion of the circuit layer 31 has a plurality of lines (not shown)formed therein that connects the driver IC 62 to the scan signal lines31B, the image data signal lines 31C, the driver circuit, and the drivepower resource lines 31D. The first laminated structure of the displaypanel 3 includes an insulating layer formed in the connection region A3and covering the circuit layer 31. The first detection lines 61 areformed above the insulating layer. The structure described here enablesthe plurality of lines in the circuit layer 31 to be formed under thefirst detection lines 61. Accordingly, the structure described hereincreases the flexibility in the layout of the plurality of lines. Inthe example of organic EL display device 1, the bank layer 35 is formedas the above described insulating layer between the first detection line61 and the circuit layer 31. In comparison with a structure where adedicated insulating layer insulates the detection lines 61 from thecircuit layer 31, the structure described above can reduce the number ofmanufacturing processes.

As shown in FIG. 5, the peripheral portions 41 a and 43 a of theinorganic barrier layers 41 and 43 are formed on the bank layer 35. Thecontact portions 61 a of the first detection line 61 are formed on theperipheral portions 41 a and 43 a of the inorganic barrier layers 41 and43. Alternatively, only one of the peripheral portions 41 a and 43 a ofthe inorganic barrier layers 41 and 43 may be formed on the bank layer35. The bank layer 35 includes a split portion (a groove portion) 35 bin the seal region A2. The slit portion 35 b is formed along the entireperiphery of the seal region A2. The split portion 35 b can preventmoisture from spreading in the bank layer 35. The contact portions 61 aof the first detection lines 61 are located above the slit portion 35 b.

As described above, the plurality of second terminals 31 f are formed inthe connection region A3. The plurality of second terminals 31 f areconnected with the ends of the plurality of first detection lines 61,respectively. The second terminals 31 f are formed in the same layer asthe first terminals 31 e. For example, both of the first terminals 31 eand the second terminals 31 f are formed in the conducive layer in whichthe circuits in circuit layer 31 are formed. The structure describedhere evens the height of the second terminals 31 f and the height of thefirst terminals 31 e, and thus enables the common FPC 65 to be stablyattached on the first terminals 31 e and the second terminals 31 f.Specifically, a pressure applied on the second terminals 31 f from theFPC 65 and a pressure applied on the first terminals 31 e from the FPC65 can be equalized in a manufacturing process where the FPC 65 ispressed on the connection region A3 of the display panel 3. The FPC 65is bonded to the display panel 3 by, for example, aerotropic conductiveadhesive. The ends of the second terminals 31 f toward the seal regionA2 are in contact with the ends of the first detection lines 61.

As shown in FIG. 1, in the example of organic EL display device 1, theplurality of first terminals 31 e and the plurality of second terminals31 f on the ends of the first detection lines 61 are arrayed in onedirection. The arrangement of the terminals 31 f and 31 e described herecan facilitate work for pressing the FPC 65 to the first terminals 31 eand the second terminals 31 f.

The organic EL display device 1 can be manufactured by the processesexampled as follows. The circuit layer 31 and the lower electrodes 32are formed on the first substrate 30. Then, the bank layer 35 is formedso as to cover the peripheral portions of the lower electrodes 32. Inthe process, the bank layer 35 is formed not to cover the firstterminals 31 e and the second terminals 31 f. After that, the organiclayer 33 and the upper electrode 34 are formed. Then, the inorganicbarrier layer 41, the organic barrier 42, and the second inorganicbarrier layer 43 are formed on the upper electrode 34 in the order ofthe layer 41, the barrier 42, and the layer 43. As described above, theinorganic barrier layers 41 and 43 are formed by using a mask so thatthe material thereof does not cover the connection region A3 (orterminals 31 e, 31 f). As described above, the peripheral edge 42 a ofthe organic barrier 42 is located inward from the seal region A2. Suchan organic barrier 42 can be made by using a mask having an openinginside the seal region A2. For example, the organic barrier 42 can beformed by vapor deposition. Alternatively, the organic barrier may beformed by printing. After forming the second inorganic barrier layer 43,the first detection lines 61 are formed on the inorganic barrier layers41 and 43. The first detection lines 61 can be formed by, for example,ink-jet printing, offset printing, and photolithography process. Afterthe first detection lines 61 are formed, the touch panel 2 is attachedon the display panel 3. At that time, the sealing member 52 is disposedon the seal region A2, and the space between the display panel 3 and thetouch panel 2 is filled with the filler 51.

As described above, the first substrate 30 is made of resin and hasflexibility. Accordingly, the peripheral portion of the display panel 3can be bent, or the portion in the connection region A3 can be folded.As a result, leeway in designing the organic EL display device 1 can beincreased.

In the present embodiment, as shown in FIG. 6, the connection region A3of the display panel 3 is folded opposite to the touch panel 2(hereinafter, the folded portion is referred as to “folded portion D”).The folded portion D enables to reduce the width of the peripheralportion of the organic EL display device 1. As described above, thesecond detection lines 21C of the touch panel 2 are connected to thefirst detection lines 61 through the conductive particles 53 containedin the sealing member 52. Accordingly, the touch panel 2 does not needto include a region to be attached to external lines such as FPC.Therefore, the size of the touch panel 2 can be reduced by theunnecessary region, and the peripheral portion of the organic EL displaydevice 1 can be reduced in the width.

As shown in FIG. 6, a spacer 71 is disposed between the folded portion Dand the rest portion of the display panel 3 (that is, the spacer 71 isdisposed between the folded portion D and a portion facing the foldedportion D). The spacer 71 includes a peripheral surface 71 a that curveslike an arc. The folded portion D is folded along the peripheral surface71 a.

The spacer 71 is disposed below the connection side seal region A2 s. Aportion of the spacer 71 is located opposite to the conductive particles53 contained in the sealing member 52 across the display panel 3. Suchan arrangement of the spacer can reduce a stress caused in theconnection side seal region A2 s when the connection region A3 of thedisplay panel 3 is folded back. For example, when the spacer 71 ispressed on the back surface of the first substrate 30 and then theconnection region A3 of the display panel 3 is folded back, a stresscaused in the connection side seal region A2 s can be reduced. As aresult, it is prevented that the contacts between the second detectionlines 21C and the conductive particles 53 and the contacts between thefirst detection lines 61C and the conductive particles 53 are unstable.

As shown in FIG. 6, a portion of the spacer 71 is preferably alsolocated between a portion including the terminals 31 e and 31 f to beconnected with the FPC 65 and the back surface of the display panel 3.The arrangement of the spacer 71 described here enables the positions ofthe terminals 31 e and 31 f to be fixed and thus improves the connectionstability between the terminals 31 e and 31 f and the FPC 65.

The spacer 71 may not be located on the entire display panel 3. Forexample, as shown in FIG. 6, the spacer 71 may be located only on thefolded portion D of the display panel 3. This arrangement can secure aspace under the display panel 3 and thus enables the space to be usedfor parts of an electric device equipping with the organic EL displaydevice 1.

In the example of organic EL display device 1, the spacer 71 has athickness larger than that of the first substrate 30. The spacer 71 ismade of a resin, such as an acrylic resin. The thickness and thematerial of the spacer 71 are not limited to the examples describedhere.

FIGS. 7 to 9 show an organic EL display device 100 that is anotherexample of embodiments according to the present invention. FIG. 7 is aplan view of the organic EL display device 100. FIG. 8 is a crosssection taken along line VIII-VIII indicated in FIG. 7. FIG. 9 is across section taken along line IX-IX indicated in FIG. 7. In thefollowing description, portions and matters different from those of theorganic EL display device 1 will be mainly explained. The elements ofthe organic EL display device 100 that are not explained below are thesame as those of the organic EL display device 1.

In the organic EL display device 100, second terminals 161 b areprovided instead of the second terminals 31 f described above on theends of the first detection lines 161. The first detection lines 161 areformed on the first inorganic barrier layer 41 and the second inorganicbarrier layer 43. As shown in FIGS. 8 and 9, the second terminals 161 bare formed in the same layer as the first detection lines 161 unlike thesecond terminals 31 f. That is, the second terminals 161 b are formed onthe first inorganic barrier layer 41 and the second inorganic barrierlayer 43, and made of the same material as that of the first detectionlines 61. The structure described here enables the second terminals 161b to be made in the same process as that of the first detection lines161.

As shown in FIG. 7, the plurality of first terminals 31 e and theplurality of second terminals 161 b are arrayed in one line. Thedistance between the first terminals 31 e and the second terminals 161b, that is, the distance L1 between the first terminal 31 e closest tothe second terminals 161 b and the second terminal 161 b closest to thefirst terminals 31 e is larger than the distance between two adjacentfirst terminals 31 e. The larger distance can stabilize the connectionsbetween the first terminals 31 e and FPC 65 and the connections betweenthe second terminals 161 b and FPC 65. In more detail, the secondterminals 161 b are formed on the inorganic barrier layers 41 and 43 andthus are positioned higher than the first terminals 31 e. Accordingly,in a process in which the FPC 65 is pressed on the connection region A3,the FPC 65 may not be equally pressed on the terminals 31 e and 161 b.As shown in FIG. 7, the structure where the distance L1 between thefirst terminals 31 e and the second terminals 161 b is larger than thedistance between two adjacent first terminals 31 e can reduce theunevenness of the pressures applied to the terminals 31 e and 161 b fromthe FPC 65.

The organic EL display device 100 can be manufactured by the processesexampled as follows. The circuit layer 31 and the lower electrodes 32are formed on the first substrate 30. Then, the bank layer 35 is formedso as to cover the peripheral portions of the lower electrodes 32. Atthe time, the bank layer 35 is formed not to cover the first terminals31 e. After that, the organic layer 33 and the upper electrode 34 areformed. Then, the inorganic barrier layer 41, the organic barrier 42,and the second inorganic barrier layer 43 are formed on the upperelectrode 34 in the order of the layer 41, the barrier 42, and the layer43. For the organic EL display device 100, unlike for the organic ELdisplay device 1, the inorganic barrier layers 41 and 43 are formedthroughput the entire the display panel 3 without a mask. Then, thefirst detection lines 61 are formed on the inorganic barrier layers 41and 43 by ink-jet printing, offset printing, photolithography process,and the like. After that, the touch panel 2 is attached on the displaypanel 3. At that time, the sealing member 52 is disposed on the sealregion A2, and the space between the display panel 3 and the touch panel2 fills with the filler 51. Finally, the inorganic barrier layers 41 and43 are removed from the connection region A3. For example, the inorganicbarrier layers 41 and 43 are removed by ashing process. In the ashingprocess, the touch panel 2, the first detection lines 161 and the secondterminals 161 b works as a mask, and thus a mask dedicated for theashing is not necessary.

The present invention is not limited to the embodiments described aboveand may be changed in various ways. For example, the following variationcan be made.

The peripheral edge 42 a of the organic barrier 42 may be located inwardfrom the seal region A2 s only on one side toward the connection regionA3 among the four sides of the seal region A2. That is, the peripheraledge 42 a of the organic barrier 42 may be located outward from theinner edge of the seal region A2 on the rest three sides of the sealregion A2.

When a plurality of conductive particles 53 are arranged in the widthdirection (E direction shown in FIG. 5) of the connection side sealregion A2 s, the peripheral edge 42 a of the organic barrier 42 may belocated inward from the conductive particle 53 disposed outermost amongthe plurality of conductive particles 53 (that is, the peripheral edge42 a may be located inward from the conductive particle 53 disposedclosest to the connection region A3), and the other conductive particles53 may be disposed above the organic barrier 42.

While there have been described what are at present considered to becertain embodiments of the invention, it will be understood that variousmodifications may be made thereto, and it is intended that the appendedclaims cover all such modifications as fall within the true spirit andscope of the invention.

What is claimed is:
 1. A semiconductor device comprising: a substrate,the substrate having a plurality of electrodes arrayed in a matrix; aninsulator covering the plurality of electrodes; a plurality of detectionelectrodes arranged so as to overlap a part of the plurality ofelectrodes; a terminal on the substrate, the terminal located along anedge of the substrate; a first detection line electrically connected tothe terminal; and a second detection line electrically connected to oneof the plurality of detection electrodes, wherein the first detectionline and the second detection line are electrically connected with eachother at a contact portion, the contact portion is located between theplurality of electrodes and an edge of the insulator in a planar view,and the substrate is folded back between the contact portion and theterminal.
 2. The semiconductor device according to claim 1, wherein theinsulator has a multilayer structure.
 3. The semiconductor deviceaccording to claim 2, wherein the multilayer structure comprises: afirst inorganic insulating layer; a second inorganic insulating layer;and an organic insulating layer between the first inorganic insulatinglayer and the second inorganic insulating layer, wherein an edge of theorganic insulating layer is located between the plurality of electrodesand an edge of the first inorganic insulating layer in the planar view,the edge of the first inorganic insulating layer is located between theedge of the organic insulating layer and the edge of the substrate inthe planar view, the second inorganic insulating layer is in contactwith the first inorganic insulating layer outside the edge of theorganic insulating layer, and the contact portion is located between theedge of the organic insulating layer and the edge of the secondinorganic insulating layer in the planar view.
 4. The semiconductordevice according to claim 3, wherein the substrate is folded backbetween the edge of the organic insulating layer and the terminal. 5.The semiconductor device according to claim 3, wherein the substrate isfolded back between the edge of the first inorganic insulating layer andthe terminal.
 6. The semiconductor device according to claim 1, whereinthe terminal is at an opposite side of the plurality of electrodes. 7.The semiconductor device according to claim 1, wherein the contactportion is covered by a sealing member.